Composition of epoxy resin, phenol resin and (epoxy resin-) CTBN

ABSTRACT

An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

TECHNICAL FIELD

The present invention relates to an epoxy resin composition and asemiconductor device using the composition. More particularly, thepresent invention relates to an epoxy resin composition exhibitingexcellent fluidity, releasing property from a mold and continuousmolding property and to a semiconductor device using the composition andexhibiting excellent resistance to solder reflow.

BACKGROUND ART

As electronic instruments are recently becoming smaller and lighter andexhibiting more excellent performances in the market, the degree ofintegration in semiconductors increases, and the surface mounting insemiconductor packages is promoted. Moreover, it is considered to beimportant for activities of corporations that the influences on theglobal environment are considered, and it is required that the use oflead which is a harmful substance be entirely prohibited by 2006 exceptspecific applications. However, since the melting point of lead-freesolder is higher than conventional lead/tin solder, the temperatureduring the mounting with solder reflow such as infrared solder reflowand dipping into a solder will be elevated to a temperature as high as240 to 260° C. from 220 to 240° C. in the conventional soldering. Due tothe elevation of the temperature during the mounting, a problem arisesin that cracks tend to be formed in the resin portion during themounting, and assurance of reliability becomes difficult. Moreover, withrespect to a lead frame, application of a lead frame treated by thenickel palladium plating in advance in place of the exterior solderplating is promoted from the standpoint of the necessity of removinglead from the exterior solder plating. Since the nickel palladiumplating has poor adhesion with conventional materials for encapsulating,cleavage tends to take place at the interface during the mounting, andcracks tend to be formed in the resin portion.

The above problems due to the elevation of the temperature during themounting have been overcome by application of epoxy resins and curingagents exhibiting small absorption of water to improve the heatresistance in soldering (for example, Patent References 1, 2 and 3).However, the epoxy resin composition exhibiting small water absorptionand small modulus such as those described above has a small crosslinkingdensity, and the molded article is soft immediately after curing. Thiscauses a problem in the molding property in that the resin adheres to amold in the continuous production, and the productivity decreases.

As the effort to improve the productivity, application of a mold releaseexhibiting an excellent releasing effect is proposed (for example,Patent Reference 4). However, a problem arises in this case in that themold release exhibiting an excellent releasing effect inevitably tendsto bloom out on the surface of the molded article, and the appearance ofthe molded articles is markedly deteriorated during the continuousproduction. It is proposed that a silicon compounds having a specificstructure is added as a means to obtain an epoxy resin compositionproviding molded articles exhibiting excellent appearance (for example,Patent References 5 and 6). However, this technology causes a problem inthat filling of the resin composition is insufficient, and theproductivity is decreased since the releasing property from a mold isinsufficient, and air vents are clogged due to attachment of the resinto the air vents. As described above, an epoxy resin composition forencapsulating semiconductor devices which can overcome the drawbacks onthe heat resistance in soldering, the releasing property from a mold,the continuous molding property, the appearance of the molded articleand the fouling on the mold, has been required.

[Patent Reference 1] Japanese Patent Application Laid-Open No. Heisei 9(1997)-3161 (pages 2 to 5)

[Patent Reference 2] Japanese Patent Application Laid-Open No. Heisei 9(1997)-235353 (pages 2 to 7)

[Patent Reference 3] Japanese Patent Application Laid-Open No. Heisei 11(1999)-140277 (pages 2 to 11)

[Patent Reference 4] Japanese Patent Application Laid-Open No.2002-80695 (pages 2 to 5)

[Patent Reference 5] Japanese Patent Application Laid-Open No.2002-97344 (pages 2 to 10)

[Patent Reference 6] Japanese Patent Application Laid-Open No.2001-310930 (pages 2 to 8)

DISCLOSURE OF THE INVENTION

The present invention has been made to overcome the above problems andhas an object of providing an epoxy resin composition exhibitingexcellent fluidity, releasing property from a mold and continuousmolding property and a semiconductor device using the epoxy resincomposition and exhibiting excellent resistance to solder reflow.

The present invention provides:

[1] An epoxy resin composition for encapsulating semiconductors whichcomprises as essential components (A) an epoxy resin, (B) a phenolresin, (C) a curing accelerator, (D) an inorganic filler and (E) acomponent comprising at least one of (e1) a butadiene-acrylonitrilecopolymer having carboxyl group and (e2) a reaction product of (e1) abutadiene-acrylonitrile copolymer having carboxyl group with an epoxyresin, wherein a content of component (e1) in the entire epoxy resincomposition is 0.01% by weight or greater and 1% by weight or smaller;[2] The epoxy resin composition for encapsulating semiconductorsdescribed in [1], wherein the epoxy resin (A) comprises at least oneepoxy resin selected from the group consisting of (a1) a biphenyl typeepoxy resin and (a2) a phenol aralkyl type epoxy resin having a skeletonstructure of biphenylene and the phenol resin (B) comprises at least onephenol resin selected from the group consisting of (b1) a phenol aralkyltype resin having a skeleton structure of phenylene and (b2) a phenolaralkyl type resin having a skeleton structure of biphenylene;[3] The epoxy resin composition for encapsulating semiconductorsdescribed in [1], wherein the epoxy resin (A) comprises (a1) a biphenyltype epoxy resin and the phenol resin (B) comprises (b1) a phenolaralkyl type resin having a skeleton structure of phenylene;[4] The epoxy resin composition for encapsulating semiconductorsdescribed in [1], wherein the epoxy resin (A) comprises (a2) a phenolaralkyl type epoxy resin having a skeleton structure of biphenylene andthe phenol resin (B) comprises (b2) a phenol aralkyl type resin having askeleton structure of biphenylene;[5] The epoxy resin composition for encapsulating semiconductorsdescribed in any one of [1] to [4], wherein content of sodium ion in thecomponent (e1) is 10 ppm or less and content of chlorine ion in thecomponent (e1) is 450 ppm or less;[6] The epoxy resin composition for encapsulating semiconductorsdescribed in any one of [1] to [5], wherein the butadiene-acrylonitrilecopolymer having carboxyl group (e1) is a compound represented by ageneral formula (1):HOOC[(Bu)_(x)((ACN)_(y)]_(z)COOH  (1)wherein Bu represents a butadiene unit, ACN represents an acrylonitrileunit, Bu and ACN may be arranged randomly or in blocks, x and y eachrepresents a positive number less than 1, x+y=1, and z represents aninteger of 50 to 80;[7] The epoxy resin composition for encapsulating semiconductorsdescribed in any one of [1] to [6], wherein the butadiene-acrylonitrilecopolymer having carboxyl group (e1) comprises an antioxidant;[8] The epoxy resin composition for encapsulating semiconductorsdescribed in [7], wherein the antioxidant is a non-phosphor typeantioxidant;[9] The epoxy resin composition for encapsulating semiconductorsdescribed in [8], wherein the antioxidant is a phenol type antioxidant;[10] The epoxy resin composition for encapsulating semiconductorsdescribed in any one of [1] to [9], which comprises (F) a componentcomprising at least one of (f1) an organopolysiloxane having carboxylgroup and (f2) a reaction product of (f1) an organopolysiloxane havingcarboxyl group with an epoxy resin, wherein a content of component (f1)in the entire epoxy resin composition is 0.01% by weight or greater and3% by weight or smaller;[11] The epoxy resin composition for encapsulating semiconductorsdescribed in [10], wherein the organopolysiloxane having carboxyl groupis an organopolysiloxane represented by following general formula (2):

wherein at least one R among a plurality of R represents a hydrocarbongroup having 1 to 40 carbon atoms and carboxyl group and rest of R eachrepresent hydrogen atom or a group selected from phenyl group and methylgroup, the atoms and the groups represented by a plurality of R may be asame with or different from each other, and n represents an averagevalue, which is a positive number of 1 to 50; and[12] A semiconductor device which comprises semiconductor elementsencapsulated by using the epoxy resin composition described in any oneof [1] to [11].

THE MOST PREFERRED EMBODIMENT TO CARRY OUT THE INVENTION

In accordance with the present invention, an epoxy resin composition forencapsulating semiconductor devices which exhibits excellent releasingproperty from a mold and continuous molding property, small stress andexcellent resistance to solder reflow can be obtained since the epoxyresin composition for encapsulating semiconductors comprises as theessential components (A) an epoxy resin, (B) a phenol resin, (C) acuring accelerator, (D) an inorganic filler and (E) a componentcomprising (e1) a butadiene-acrylonitrile copolymer having carboxylgroup and/or (e2) a reaction product of (e1) a butadiene-acrylonitrilecopolymer having carboxyl group with an epoxy resin.

The present invention will be described specifically in the following.

As the epoxy resin of component (A) used in the present invention,monomers, oligomers and polymers having two or more epoxy groups in onemolecule in general can be used. Examples of the epoxy resin includeepoxy resins of the phenol novolak type, epoxy resins of the cresolnovolak type, epoxy resins of the biphenyl type, epoxy resins of thebisphenol type, epoxy resins of the stilbene type, epoxy resins of thetriphenolmethane type, epoxy resins of the phenol aralkyl type, epoxyresins of the naphthol type, epoxy resins of the alkyl-modifiedtriphenolmethane type, epoxy resins having a triazine nucleus and epoxyresins of the dicyclopentadiene-modified phenol type. However, the epoxyresin is not limited to the resins described above. The epoxy resin maybe used singly or in combination of two or more. When the resistance tosoldering is required, it is preferable that an epoxy resin of thebiphenyl type, an epoxy resin of the bisphenol type or an epoxy resinsof the stilbene type which is a crystalline solid at the ordinarytemperature and a liquid having a very small viscosity at temperaturesexceeding the melting point and allows mixing with inorganic fillers ingreat amounts is used among the above epoxy resins. Even when otherepoxy resins are used, epoxy resins having a very small viscosity arepreferable. When flexibility and a small moisture absorption arerequired, it is preferable that an epoxy resin of the phenol aralkyltype having the skeleton structure of phenylene or biphenylene is used.However, the use of the epoxy resin having flexibility and a smallviscosity causes a problem in that the releasing property from a molddecreases due to a decrease in the crosslinking density althoughinorganic fillers can be used in a great amount. The releasing propertyfrom a mold can be improved by using Component (E) described later.

As the phenol resin (B) used in the present invention, monomers,oligomers and polymers having two or more phenolic hydroxyl groups inone molecule in general can be used. Examples of the phenol resininclude phenol novolak resins, cresol novolak resins, triphenolmethaneresins, phenol resins modified with terpene, phenol resins modified withdicyclopentadiene, phenol aralkyl resins having a skeleton structure ofphenylene or biphenylene and naphthol aralkyl resins having a skeletonstructure of phenylene or biphenylene. However, the phenol resin is notlimited to the resins described above. The phenol resin may be usedsingly or in combination of two or more. When the resistance tosoldering is required, it is preferable that a phenol aralkyl resinhaving a skeleton structure of phenylene or biphenylene is used amongthe above phenol resins so that inorganic fillers can be added in agreat amount into a resin having flexibility and a small viscosity, anda small moisture absorption can be provided to the resin, similarly tothe epoxy resin. However, the use of the phenol resin having flexibilityand a small viscosity causes a problem in that the releasing propertyfrom a mold decreases as the crosslinking density decreases. Thereleasing property from a mold can be improved by using a mold releasedescribed later.

The ratio of the amount by equivalent of the epoxy group in the entireepoxy resin to the amount by equivalent of the hydroxyl group in theentire phenol group used in the present invention is preferably 0.5 orgreater and 2 or smaller and more preferably 0.7 or greater and 1.5 orsmaller. The decreases in the moisture resistance and the curingproperty can be suppressed when the ratio is within the above range.

The curing accelerator (C) used in the present invention is an agentwhich works as the catalyst for the curing reaction between the epoxygroup in the epoxy resin and the hydroxyl group in the phenol resin.Examples of the curing accelerator include amine-based compounds such astributylamine and 1,8-diazabicyclo(5.4.0)undecene; organic phosphoruscompounds such as triphenylphosphine and tetraphenylphosphoniumtetraphenylborate salts; and imidazole compounds such as2-methylimidazole. However, the curing accelerator is not limited to thecompounds described above. The curing accelerator may by used singly orin combination of two or more.

As the inorganic filler (D) used in the present invention, inorganicfillers conventionally used for epoxy resin compositions forencapsulating semiconductors can be used. However the inorganic filleris not particularly limited. Examples of the inorganic filler includefused silica, crystalline silica, alumina, silicon nitride and aluminumnitride. When the inorganic filler is used in a great amount, ingeneral, fused silica is used. As the fused silica, any of crushed fusedsilica and spherical fused silica can be used. Spherical silica ispreferable so that the amount of the fused silica is increased, and theincrease in the melt viscosity of the epoxy resin composition issuppressed. For further increasing the amount of spherical silica, it ispreferable that the distribution of the particle size of the sphericalsilica is adjusted to be broader.

In the present invention, it is essential that the epoxy resincomposition comprises component (E) comprising (e1) abutadiene-acrylonitrile copolymer having carboxyl group and/or (e2) areaction product of (e1) a butadiene-acrylonitrile copolymer havingcarboxyl group with an epoxy resin in an amount of 0.01% by weight orgreater and 1% by weight or smaller in an entire epoxy resincomposition. The butadiene-acrylonitrile copolymer having carboxyl groupof component (e1) is a copolymer of butadiene and acrylonitrile. Whenthe resin composition comprises component (e1) and component (e2) whichis a reaction product of component (e1) with an epoxy resin, not onlythe excellent crack resistance is obtained but also the releasingproperty from a mold can be improved.

The butadiene-acrylonitrile copolymer having carboxyl group of component(e1) is not particularly limited. Compounds having carboxyl groups atboth ends of the structure are preferable, and compounds represented bygeneral formula (1) are more preferable. Due to the polarity of carboxylgroup, dispersion of the butadiene-acrylonitrile copolymer in the epoxyresin comprised in the epoxy resin composition for encapsulatingsemiconductors as a material is improved, and the increase in thefouling on the surfaces of a mold and a molded article can besuppressed. In general formula (1), x represents a content of butadieneunit in molar fraction and is a positive number less than 1, and yrepresents a content of acrylonitrile unit in molar fraction and is apositive number less than 1, and z represents an integer of 50 to 80.The resin composition of the present invention may further comprise ascomponent (E) a reaction product (e2) obtained by melting and reactingthe entire amount or a portion of (e1) the butadiene-acrylonitrilecopolymer having carboxyl group of component (e1) with an epoxy resinand a curing accelerator in advance. As the epoxy resin, monomers,oligomers and polymers having two or more epoxy groups in one moleculein general can be used. The epoxy resin used here is not limited by itsmolecular weight or molecular structure and the same epoxy resin whichis exemplified before to be usable as the epoxy resin (A). As for thecuring accelerator, it is sufficient that the curing acceleratoraccelerates the curing reaction between carboxyl group in thebutadiene-acrylonitrile copolymer having carboxyl group and epoxy groupin the epoxy resin, and the same curing accelerator which is exemplifiedbefore to be usable as the curing accelerator (C) can be used. It isnecessary that the content of component (e1) in the entire epoxy resincomposition is 0.01% by weight or greater and 1% by weight or smaller.The content is preferably 0.05% by weight or greater and 0.5% by weightor smaller and more preferably 0.1% or greater and 0.3% by weight orsmaller. Problems such as insufficient filling during molding due to adecrease in the fluidity and deformation of a gold wire due to anincreased viscosity can be suppressed when the amount is within theabove range.HOOC[(Bu)_(x)(ACN)_(y)]_(z)COOH  (1)In the above general formula (1), Bu represents a butadiene unit, ACNrepresents an acrylonitrile unit, Bu and ACN may be arranged randomly orin blocks, x and y each represents a positive number less than 1, x+y=1,and z represents an integer of 50 to 80.

The content of acrylonitrile unit in molar fraction y of thebutadiene-acrylonitrile copolymer having carboxyl group (e1) used in thepresent invention is preferably 0.05 or more and less than 0.30 and morepreferably 0.10 or more and 0.25 or less. The value of y affects thecompatibility of the butadiene-acrylonitrile copolymer having carboxylend group with epoxy resin matrix. When y is in these ranges, it ispossible to control the fouling on a mold or deterioration in appearanceof articles of cured resin due to phase separation between thebutadiene-acrylonitrile copolymer having carboxyl group and the epoxyresin matrix. The possibility of occurrences of drawbacks such asinsufficient filling on molding due to lowering of fluidity ordeformation of gold wire in semiconductor devices due to increasedviscosity can be controlled.

The number average molecular weight of the butadiene-acrylonitrilecopolymer having carboxyl group of component (e1) used in the presentinvention is preferably 2000 or more and less than 5000 and morepreferably 3000 or more and 4000 or less. When the number averagemolecular weight is in these ranges, it is possible to control thepossibility of occurrences of drawbacks such as insufficient filling onmolding due to lowering of fluidity or deformation of gold wire insemiconductor devices due to increased viscosity can be controlled.

The carboxyl equivalent of the butadiene-acrylonitrile copolymer havingcarboxyl group (e1) used in the present invention is preferably 1200 ormore and less than 3000 and more preferably 1700 or more and 2500 orless. When the carboxyl equivalent is in these ranges, it is possible tocontrol the drawbacks such as the decrease of fluidity or deteriorationof mold release property of the resin composition on molding and foulingof molds or molded articles and thus the continuous molding capabilityadvantageously attained.

In the present invention, it is preferable that the content of sodiumion in the carboxyl equivalent of the butadiene-acrylonitrile copolymerhaving carboxyl group (e1) is 10 ppm or less and the content of chlorineion in the copolymer (e1) is 450 ppm or less. The content of sodium ionand chlorine ion can be obtained by the following methods. The contentof sodium ion is determined by ICP emission spectrometry after thebutadiene-acrylonitrile copolymer having carboxyl group (e1) isdecomposed and ashed under dry condition and dissolved in an acid. Thecontent of chlorine ion is determined by ion chromatography. When thecontent of sodium ion or chlorine ion is within the above range, thepossibility of deterioration of the reliability in anti-humidityproperty of semiconductor device due to the corrosion of circuit bysodium ion or chlorine ion.

It is preferable that the butadiene-acrylonitrile copolymer havingcarboxyl group (e1) comprises an anti oxidant and it is more preferablethat the antioxidant is a non-phosphor type antioxidant. Thenon-phosphor type antioxidants include phenol type antioxidants, aminetype antioxidants and thioether type antioxidants. Among these, phenoltype antioxidants are preferable and for example,2,6-di-tert-butyl-4-methylphenol, 2,6-di-tert-butyl-4-ethylphenol, 2,2′ethylidenebis(4,6-di-tert-butylphenol), 2,2′ethylidenebis(2,4-di-tert-butylphenol), 4,6-di-tert-butylphenol or thelike can be used, although specifically limited to these. The phosphortype antioxidants are not preferable because these have a tendency toenhance the corrosion of circuit and hence the reliability inanti-humidity property of semiconductor device is deteriorated.

In the present invention, (F) a component comprising (f1) anorganopolysiloxane having carboxyl group and/or (f2) a reaction productof (f1) an organopolysiloxane having carboxyl group with an epoxy resinmay be used. The organopolysiloxane having carboxyl group of component(f1) which can be used in the present invention is an organopolysiloxanehaving one or more carboxyl group in one molecule. When component (F)comprising (f1) an organopolysiloxane having carboxyl group and/or (f2)a reaction product of (f1) an organopolysiloxane having carboxyl groupwith an epoxy resin is used, the effect of suppressing the fouling on amold and a molded article and remarkably improving the continuousmolding property can be obtained without decreasing the fluidity or thereleasing property in molding of the resin composition.

The organopolysiloxane having carboxyl group of component (f1) which canbe used in the present invention is not particularly limited. Theorganopolysiloxane represented by general formula (2) is preferable. Ingeneral formula (2), R represents an organic group. Among the entireorganic groups represented by R, at least one group is an organic grouphaving carboxyl group and 1 to 40 carbon atoms, and the rest of thegroups each represent hydrogen atom or a group selected from phenylgroup and methyl group. The atoms and the groups represented by aplurality of R may be the same with or different from each other. Thedeterioration in the appearance of the molded article due to a decreasein compatibility with the resin can be prevented when the number ofcarbon atoms in the organic group having carboxyl group is within theabove range. In general formula (2), n represents an average number,which is an integer of 1 to 50. The decrease in the fluidity due to anincrease in the viscosity of the oil itself can be suppressed when thevalue of the number represented by n is within the above range. When theorganopolysiloxane represented by general formula (2) is used, theappearance of the molded article can be remarkably improved without adecrease in the fluidity. When the reaction product of component (f2)obtained by melting and reacting the entire amount or a portion of (f1)the organopolysiloxane having carboxyl group with an epoxy resin and acuring accelerator in advance is used, the fouling on the mold duringthe continuous molding is suppressed, and the continuous moldingproperty is remarkably improved. As for the curing accelerator, it issufficient that the curing accelerator accelerates the curing reactionbetween the carboxyl group in the organopolysiloxane and epoxy group inthe epoxy resin, and the same curing accelerator which is exemplifiedbefore to be usable as the curing accelerator (C) can be used. Thenumber of carbon atom in the organic group having carboxyl group in theorganopolysiloxane represented by general formula (2) is the total ofthe number of carbon atoms in the hydrocarbon groups and the number ofcarbon atom in carboxyl group in the organic group.

In the above general formula (2), at least one R among a plurality of Rrepresents a hydrocarbon group having 1 to 40 carbon atoms and carboxylgroup and the rest of R each represent hydrogen atom or a group selectedfrom phenyl group and methyl group, the atoms and the groups representedby a plurality of R may be the same with or different from each other,and n represents an average value, which is a positive number of 1 to50.

It is preferable that the amount of component (f1) which can be used inthe present invention is 0.01% by weight or more and 3% by weight orless in the entire epoxy resin composition. The fouling in theappearance of the molded article with the mold release or theorganopolysiloxane in an excess amount can be suppressed, and theexcellent continuous molding property can be obtained when the amount isthe within the above range.

In the present invention, other organopolysiloxanes can be used incombination as long as the effect of addition of component (F)comprising (f1) an organopolysiloxane having carboxyl group and/or (f2)a reaction product of (f1) an organopolysiloxane having carboxyl groupwith an epoxy resin is not adversely affected.

The epoxy resin composition of the present invention may furthercomprise various additives in combination with components (A) to (F).Examples of the additive include flame retardants such as brominatedepoxy resins, antimony trioxide, phosphorus compounds and metalhydroxides; coupling agents such as γ-glycidoxypropyltrimethoxysilane;coloring agents such as carbon black and red oxide; natural waxes suchas carnauba wax; synthetic waxes such as polyethylene wax; mold releasessuch as higher fatty acids and metal salts thereof, for example stearicacid and zinc stearate, and paraffin; and antioxidants such as bismuthoxide hydrate. Where necessary, the inorganic filler may be used afterbeing subjected to a surface treatment with a coupling agent, an epoxyresin or a phenol resin in advance. Examples of the process of thesurface treatment include the process of mixing with a solvent, followedby removal of the solvent and the process of adding directly to theinorganic filler, followed by treating by a mixer.

The epoxy resin composition of the present invention can be obtained bymixing components (A) to (F) and other additives using a mixer or thelike, followed by further mixing under heating by a heated kneader,heated rolls or an extruder, cooling and pulverizing the mixture.

For encapsulating electronic parts such as semiconductor elements usingthe epoxy resin composition of the present invention and preparingsemiconductor devices, a conventional molding and curing process such asthe transfer molding process, the compression molding process and theinjection molding process can be conducted.

EXAMPLES

The present invention will be described more specifically with referenceto examples in the following. However, the present invention is notlimited to the examples.

Example 1

The following components were mixed, further mixed at 95° C. for 8minutes using heated rolls, cooled and pulverized, and an epoxy resincomposition was obtained. The obtained epoxy resin composition wasevaluated in accordance with the methods also shown in the following.

E-1: An epoxy resin expressed by formula (3) 8.07 parts by weight[manufactured by NIPPON KAYAKU Co., Ltd.; NC3000P; the softening point:58° C.; the epoxy equivalent: 274]

H-1: A phenol resin expressed by formula (4) 5.98 parts by weight[manufactured by MEIWA KASEI Co., Ltd.; MEH-7851SS; the softening point:107° C.; the hydroxyl equivalent: 203]

1,8-Diazabicyclo(5.4.0)undecene-7 (referred to as 0.15 parts by weightDBU, hereinafter) Fused spherical silica (the average particle 85.00parts by weight  diameter: 21 μm) Butadiene-acrylonitrile copolymer 10.20 parts by weight [manufactured by UBE KOSAN Co., Ltd.; HYCAR CTBN1008-SP [a butadiene- acrylonitrile copolymer represented by generalformula (1) wherein x = 0.82, y = 0.18, average value of z is 62, numberaverage molecular weight is 3550, carboxyl equivalent is 2200 g/eq,content of sodium ion is 5 ppm, content of chlorine ion is 200 ppm, andcontains 2,6-di-tert- butyl-4-methylphenol as a non-phosphor typeantioxidant] Coupling agent (γ-glycidoxypropyltrimethoxy- 0.20 parts byweight silane) Carbon black 0.20 parts by weight Carnauba wax 0.20 partsby weightMethods of Evaluation

Spiral flow: Using a low pressure transfer molding machine, an epoxyresin composition was injected into a mold for the measurement of spiralflow in accordance with EMMI-1-66 under the condition of a moldtemperature of 175° C., an injection pressure of 6.9 MPa and a curingtime of 120 seconds, and the length of flow was measured. The unit wascm. The spiral flow was decided to be poor (failed) when the length wasshorter than 100 cm, and to be good (passed) when the length was 100 cmor longer.

Continuous molding property: Using a low pressure automatic transfermolding machine, 700 shots of molding of 80pQFP (a Cu lead frame; theouter dimensions of the package: 14 mm×20 mm×2 mm thickness; the size ofthe pad: 6.5 mm×6.5 mm; the size of the chip: 6.0 mm×6.0 mm) wereconducted under the condition of a mold temperature of 175° C., aninjection pressure of 9.6 MPa and a curing time of 70 seconds. Themolding property was decided to be excellent when the continuous moldingof 700 shots could be conducted without problems such as insufficientfilling; to be good when the continuous molding of 500 shots could beconducted without problems such as insufficient filling; and to be poorwhen insufficient filling took place before 500 shots were completed.

Appearance of a molded article and fouling on a mold: Fouling on thepackage and the mold used in the above after 500 shots and 700 shots ofthe continuous molding was examined by visual observation. The resultwas evaluated to be excellent when no fouling was found after 700 shots,to be good when no fouling was found after 500 shots, and to be poorwhen fouling was found before 500 shots were completed.

Deformation of a gold wire: Using a low pressure transfer moldingmachine, molding of 160pLQFP (PPF frame; the size of the package: 24mm×24 mm×1.4 mm thickness; the size of the chip: 7.0 mm×7.0 mm; thethickness of the gold wire: 25 μm; the length of the gold wire: 3 mm)was conducted under the condition of a mold temperature of 175° C., aninjection pressure of 9.3 MPa and a curing time of 120 seconds. The160pQFP package obtained by the molding was examined by observationusing a soft X-ray fluoroscopy apparatus, and the ratio: (the amount offlow)/(the length of the gold wire) was calculated and used as thedeformation of a gold wire. The result was evaluated to be good when thedeformation was 4% or smaller, and to be poor when the deformationexceeded 4%.

Resistance to soldering: The package obtained above by the molding inthe evaluation of the continuous molding property was post-cured at 175°C. for 8 hours. After the humidifying treatment at 85° C. under arelative humidity of 85% for 168 hours, the package was dipped into asolder tank at 260° C. for 10 seconds. Then, the package was examined byobservation using a microscope, and the fraction of crack formation wascalculated as: [(the fraction of formation of cracks)=(the number ofpackages having external cracks)/(the number of the entirepackages)×100]. The unit was %. Ten packages were used for theexamination. The adhesion at the interface of the semiconductor deviceand the cured product of the epoxy resin composition was examined byobservation using an ultrasonic crack detector. Ten packages were usedfor the evaluation. The result was evaluated to be good when thefraction of crack formation was 0% and no cleavage was found and to bepoor when a crack or a cleavage was found.

Examples 2 to 13 and Comparative Examples 1 to 3

Epoxy resin compositions were obtained in accordance with theformulations shown in Tables 1, 2 and 3 and in accordance with the sameprocedures as those conducted in Example 1 and evaluated in accordancewith the same methods as those conducted in Example 1. The results areshown in Tables 1, 2 and 3. Raw materials other than those used inExample 1 are shown in the following.

E-2: An epoxy resin of the biphenyl type expressed by formula (5)[manufactured by JAPAN EPOXY RESIN Co., Ltd.; YX-4000; the epoxyequivalent: 185 g/eq; the melting point: 105° C.]

H-2: A phenol resin of the p-xylylene-modified novolak type which isexpressed by formula (6) [manufactured by MITSUI KAGAKU Co., Ltd.;XCL-4L; the hydroxyl equivalent: 168 g/eq; the softening point: 62° C.]

A melted reaction product A: An epoxy resin of the bisphenol A type[manufactured by JAPAN EPOXY RESIN Co., Ltd.; YL-6810; the epoxyequivalent: 170 g/eq; the melting point: 47° C.] in an amount of 66.1parts by weight was melted by heating at 140° C. Then, 33.1 parts byweight of butadiene-acrylonitrile copolymer 1 [manufactured by UBE KOSANCo., Ltd.; HYCAR CTBN 1008-SP] and 0.8 parts, by weight oftriphenyl-phosphine were added. The resultant mixture was mixed bymelting for 30 minutes, and melted reaction product A was obtained.

Butadiene-acrylonitrile copolymer 2: [a butadiene-acrylonitrilecopolymer represented by formula (1) wherein x=0.82, y=0.18, averagevalue of z is 62, number average molecular weight is 3550, carboxylequivalent is 2200 g/eq, content of sodium ion is 5 ppm, content ofchlorine ion is 200 ppm, and contains an organic phosphor typeantioxidant Geltrol manufactured by AGIRITE]

Butadiene-acrylonitrile copolymer 3: [a butadiene-acrylonitrilecopolymer represented by formula (1) wherein x=0.82, y=0.18, averagevalue of z is 62, number average molecular weight is 3550, carboxylequivalent is 2200 g/eq, content of sodium ion is 500 ppm, content ofchlorine ion is 1500 ppm, and contains 4,6-di-tert-butylphenol as anon-phosphor type antioxidant]

Butadiene-acrylonitrile copolymer 4: [a butadiene-acrylonitrilecopolymer represented by formula (1) wherein x=0.82, y=0.18, averagevalue of z is 62, number average molecular weight is 3550, carboxylequivalent is 2200 g/eq, content of sodium ion is 5 ppm, content ofchlorine ion is 200 ppm, and contains no antioxidant]

Organopolysiloxane 1: An organopolysiloxane expressed by formula (7):

Organopolysiloxane 2: An organopolysiloxane expressed by formula (8):

Organopolysiloxane 3: An organopolysiloxane expressed by formula (9):

Organopolysiloxane 4: An organopolysiloxane expressed by formula (10):

Melted reaction product B: An epoxy resin of the bisphenol A type[manufactured by JAPAN EPOXY RESIN Co., Ltd.; YL-6810; the epoxyequivalent: 170 g/eq; the melting point: 47° C.] in an amount of 66.1parts by weight was melted by heating at 140° C. Then, 33.1 parts byweight of organopolysiloxane 3 [the organopolysiloxane expressed byformula (9)] and 0.8 parts by weight of triphenylphosphine were added.The resultant mixture was mixed by melting for 30 minutes, and meltedreaction product B was obtained.

TABLE 1 Example 1 2 3 4 5 6 7 E-1 8.07 7.57 7.97 7.79 9.50 7.97 E-2 4.65H-1 5.98 6.08 5.88 5.76 7.05 5.88 H-2 4.20 DBU 0.15 0.15 0.15 0.15 0.150.15 0.15 Spherical fused silica 85.00 85.00 85.00 90.00 85.00 80.0085.00 Butadiene-acrylonitrile 0.20 0.20 0.20 0.50 0.20 0.20 copolymer 1Melted reaction product A 0.60 Organopolysiloxane 1 0.20 0.20 0.20 2.50Organopolysiloxane 2 0.20 Coupling agent 0.20 0.20 0.20 0.20 0.20 0.200.20 Carbon black 0.20 0.20 0.20 0.20 0.20 0.20 0.20 Carnauba wax 0.200.20 0.20 0.20 0.20 0.20 0.20 Spiral flow (cm) 110 105 114 120 103 124110 Continuous molding property G EX EX EX EX EX EX Appearance of moldedarticle G G EX EX EX EX EX Fouling on mold G G EX EX EX G EX Deformationof gold wire G G G G G G G Resistance to solder reflow G G G G G G GNote: In tables 1 to 3, EX means “excellent”, G means “good” and P means“poor”.

TABLE 2 Example 8 9 10 11 12 13 E-1 7.97 7.97 7.45 7.97 7.97 7.97 H-15.88 5.88 6.00 5.88 5.88 5.88 DBU 0.15 0.15 0.15 0.15 0.15 0.15Spherical fused silica 85.00 85.00 85.00 85.00 85.00 85.00Butadiene-acrylonitrile copolymer 1 0.20 0.20 0.20Butadiene-acrylonitrile copolymer 2 0.20 Butadiene-acrylonitrilecopolymer 3 0.20 Butadiene-acrylonitrile copolymer 4 0.20Organopolysiloxane 1 0.20 0.20 0.20 Organopolysiloxane 3 0.20Organopolysiloxane 4 0.20 Melted reaction product B 0.60 Coupling agent0.20 0.20 0.20 0.20 0.20 0.20 Carbon black 0.20 0.20 0.20 0.20 0.20 0.20Carnauba wax 0.20 0.20 0.20 0.20 0.20 0.20 Spiral flow (cm) 109 111 125115 113 117 Continuous molding property EX G EX EX EX EX Appearance ofmolded article EX G G EX EX EX Fouling on mold EX G G EX EX EXDeformation of gold wire G G G G G G Resistance to solder reflow G G G GG G

TABLE 3 Comparative Example 1 2 3 E-1 8.20 7.37 8.07 H-1 6.05 5.48 5.98DBU 0.15 0.15 0.15 Spherical fused silica 85.00 85.00 85.00Butadiene-acrylonitrile copolymer 1 1.20 Organopolysiloxane 1 0.20 0.20Coupling agent 0.20 0.20 0.20 Carbon black 0.20 0.20 0.20 Carnauba wax0.20 0.20 0.20 Spiral flow (cm) 123 92 118 Continuous molding property PEX G Appearance of molded article P EX G Fouling on mold P EX GDeformation of gold wire G P G Resistance to solder reflow P G P

INDUSTRIAL APPLICABILITY

The epoxy resin composition of the present invention exhibits theexcellent properties in that the moisture absorption and the stress aresmall. When semiconductor elements are encapsulating by molding usingthe composition, the releasing property from the mold and the continuousmolding property are excellent, and the adhesion with a lead frame, inparticular a plated copper lead frame (such as a silver-plated leadframe, a nickel-plated lead frame and a preplated frame having goldplating on a nickel/palladium alloy), is also excellent. Thesemiconductor device exhibiting excellent resistance to solder reflowcan be obtained. Therefore, the epoxy resin composition can beadvantageously used for semiconductor devices for which the surfacemounting is conducted using a lead-free solder.

1. An epoxy resin composition which comprises (A) an epoxy resincomprising at least one epoxy resin selected from the group consistingof (a1) a biphenyl epoxy resin and (a2) a phenol aralkyl epoxy resinhaving a skeleton structure of biphenylene, (B) a phenol resincomprising at least one phenol resin selected from the group consistingof (b1) a phenol aralkyl resin having a skeleton structure of phenyleneand (b2) a phenol aralkyl resin having a skeleton structure ofbiphenylene, (C) a curing accelerator, (D) an inorganic filler, (E) atleast one of (e1) a butadiene-acrylonitrile copolymer having carboxylgroup and (e2) a reaction product of (e1) a butadiene-acrylonitrilecopolymer having carboxyl group with an epoxy resin, wherein component(e1) is present in the entire epoxy resin composition in an amount of0.01% by weight to 1% by weight and (F) at least one of (f1) anorganopolysiloxane having a carboxyl group and (f2) a reaction productof (f1) an organopolysiloxane having a carboxyl group with an epoxyresin, wherein component (f1) is present in the entire epoxy resincomposition in an amount of 0.01% by weight to 3% by weight.
 2. Theepoxy resin composition according to claim 1, wherein the epoxy resin(A) comprises (a1) a biphenyl epoxy resin and the phenol resin (B)comprises (b1) a phenol aralkyl resin having a skeleton structure ofphenylene.
 3. The epoxy resin composition according to claim 1, whereinthe epoxy resin (A) comprises (a2) a phenol aralkyl epoxy resin having askeleton structure of biphenylene and the phenol resin (B) comprises(b2) a phenol aralkyl resin having a skeleton structure of biphenylene.4. The epoxy resin composition according to claim 1, wherein content ofsodium ion in (e1) is 10 ppm or less and content of chlorine ion in (e1)is 450 ppm or less.
 5. The epoxy resin composition according to claim 1,wherein the butadiene-acrylonitrile copolymer having carboxyl group (e1)is a compound represented by formula (1):HOOC[(Bu)_(x)(ACN)_(y)]_(z)COOH  (1) wherein Bu represents a butadieneunit, ACN represents an acrylonitrile unit, Bu and ACN may be arrangedrandomly or in blocks, x and y each represents a positive number lessthan 1, x+y=1, and z represents an integer of 50 to
 80. 6. The epoxyresin composition according to claim 1, wherein the organopolysiloxanehaving carboxyl group is an organopolysiloxane represented by formula(2):

wherein at least one R represents an organic group having a carboxylgroup, said organic group comprising 1 to 40 carbon atoms and rest of Reach represent a hydrogen atom, a phenyl group or methyl group, theplurality of R groups may be the same or different, and n represents anaverage value, which is a positive number of 1 to 50.